The goop on the chips is the funniest part - I've taken apart various bits of equipment (mostly from China) and they often attempt to obscure the part numbers to obfuscate, but even they know to grind/laser them off instead of putting goop on top... and it's still possible to figure out what they are just by their package and pinouts.

The low integration of the design suggests that it's probably at least 5 or more years old; these days, all that functionality would fit in 3-4 tiny BGA ICs.